Thermal Module

VC (Vapor Chamber), 3DVC (3D Vapor Chamber), air-cooled, and liquid-cooled radiators are essential components primarily used for critical electronic parts such as CPUs, Graphics Cards (GPUs), and Motherboard Chipsets. The materials for heat sinks are ranked by their thermal conductivity from highest to lowest as silver, copper, aluminum, and steel, with copper being the material most commonly adopted for heat dissipation solutions. Heat sinks play a vital role in various fields, including computers, automotive engines, and indoor heating systems. Specifically, computer heat sinks protect device performance and extend lifespan by lowering operating temperatures, while automotive engine radiators manage and dissipate heat into the air to maintain the engine's optimal working temperature.